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CY7C1318KV18-250BZXC Infineon SRAM | 165-FBGA (13X15) | 250MHz, 18Mb

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ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297 ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297
产品描述
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Product Overview

The CY7C1318KV18-250BZXC is a high-performance 18-Mbit synchronous SRAM from Infineon, organized as 1M x 18. It operates at 250 MHz with a 2-cycle read latency and 1-cycle write latency, providing fast data access for demanding applications. The device uses a 1.8V core power supply and 1.5V/1.8V I/O, and is housed in a compact 165-ball FBGA package (13x15 mm). It features QDR™ II+ architecture with separate read and write ports, enabling simultaneous read and write operations at full clock speed.

Detailed Technical Specifications

Parameter Value
Part Number CY7C1318KV18-250BZXC
Brand Infineon
Memory Size 18 Mbit
Organization 1M x 18
Frequency 250 MHz
Supply Voltage (Core) 1.8V
Supply Voltage (I/O) 1.5V / 1.8V
Package 165-FBGA (13x15 mm)
Operating Temperature 0°C to +70°C
Architecture QDR™ II+
Read Latency 2 cycles
Write Latency 1 cycle
Interface Separate read/write ports

Key Features

  • High-speed 250 MHz operation
  • 18 Mbit density with 1M x 18 organization
  • QDR™ II+ architecture for simultaneous read/write
  • Low power 1.8V core and 1.5V/1.8V I/O
  • Compact 165-ball FBGA package (13x15 mm)
  • 2-cycle read latency and 1-cycle write latency
  • On-chip DLL for precise timing
  • IEEE 1149.1 JTAG boundary scan

Target Applications

The CY7C1318KV18-250BZXC is ideal for high-bandwidth networking and telecommunications equipment, such as 5G base stations, network switches, and routers. It is also used in advanced driver-assistance systems (ADAS) for automotive applications, including radar and lidar processing. Other applications include high-end test and measurement equipment, medical imaging systems, and high-performance computing (HPC) accelerators.

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for CY7C1318KV18-250BZXC. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

CY7C1318KV18-250BZXC 是英飛凌推出的一款高性能 18 Mbit 同步 SRAM,組織為 1M x 18。它在 250 MHz 頻率下工作,具有 2 週期讀取延遲和 1 週期寫入延遲,為要求苛刻的應用提供快速數據訪問。該器件使用 1.8V 核心電源和 1.5V/1.8V I/O,封裝在緊湊的 165 球 FBGA(13x15 mm)中。它採用 QDR™ II+ 架構,具有獨立的讀寫端口,可在全時鐘速度下同時進行讀寫操作。

詳細技術參數

參數 數值
型號 CY7C1318KV18-250BZXC
品牌 Infineon
存儲容量 18 Mbit
組織 1M x 18
頻率 250 MHz
核心電壓 1.8V
I/O 電壓 1.5V / 1.8V
封裝 165-FBGA (13x15 mm)
工作溫度 0°C 至 +70°C
架構 QDR™ II+
讀取延遲 2 週期
寫入延遲 1 週期
接口 獨立讀寫端口

核心特性

  • 高速 250 MHz 操作
  • 18 Mbit 密度,1M x 18 組織
  • QDR™ II+ 架構,支持同時讀寫
  • 低功耗 1.8V 核心和 1.5V/1.8V I/O
  • 緊湊的 165 球 FBGA 封裝(13x15 mm)
  • 2 週期讀取延遲和 1 週期寫入延遲
  • 片內 DLL 實現精確時序
  • IEEE 1149.1 JTAG 邊界掃描

典型應用場景

CY7C1318KV18-250BZXC 非常適合高帶寬網絡和電信設備,例如 5G 基站、網絡交換機和路由器。它還用於汽車應用的高級駕駛輔助系統(ADAS),包括雷達和激光雷達處理。其他應用包括高端測試和測量設備、醫學成像系統以及高性能計算(HPC)加速器。

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 CY7C1318KV18-250BZXC 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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