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STM32MP257FAI3 ST Microprocessors | 436-TFBGA (18x18) | Dual Cortex-A7, Cortex-M4

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STM32F103C8T6NE555PLM358DRESP32-WROOM-32TL431AIDBZRAMS1117-3.3LM7805MAX3232CSEPC817CTPS5430DDAR STM32F103C8T6NE555PLM358DRESP32-WROOM-32TL431AIDBZRAMS1117-3.3LM7805MAX3232CSEPC817CTPS5430DDAR
1N40072N2222IRFZ44NFGA25N120S8050M7(1N4007)SS14TIP122AO3400IKW40N120H3 1N40072N2222IRFZ44NFGA25N120S8050M7(1N4007)SS14TIP122AO3400IKW40N120H3
ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297 ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297
产品描述
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Product Overview

The STM32MP257FAI3 is a high-performance dual-core microprocessor from STMicroelectronics, combining an Arm Cortex-A7 dual-core application processor and an Arm Cortex-M4 real-time coprocessor. It is designed for advanced industrial and consumer applications requiring rich user interfaces, real-time control, and connectivity. The device is housed in a 436-ball TFBGA package (18x18 mm) and offers a wide range of integrated peripherals, including a 3D GPU, MIPI-DSI display interface, and multiple communication interfaces.

Detailed Technical Specifications

Parameter Value
Core Processors Dual Arm Cortex-A7 (up to 800 MHz) + Cortex-M4 (up to 209 MHz)
Package 436-TFBGA (18x18 mm)
Operating Temperature -40°C to +125°C
Memory Up to 1 MB SRAM, external DDR3/DDR3L/LPDDR2 support
GPU Vivante GCNanoUltra 3D GPU
Display Interface MIPI-DSI (2 lanes)
Camera Interface Parallel DCMI
Connectivity 2x Gigabit Ethernet, 2x USB 2.0 OTG, 8x UART, 5x SPI, 4x I2C, SDMMC, SAI, SPDIF
Security Secure boot, crypto accelerators, TRNG
Power Management Integrated PMIC, multiple low-power modes

Key Features

  • Dual-core architecture for asymmetric multiprocessing (AMP) or symmetric multiprocessing (SMP)
  • Rich 3D graphics with Vivante GPU for HMI applications
  • Advanced security features for secure IoT deployments
  • Wide operating temperature range for industrial environments
  • Comprehensive development ecosystem with STM32CubeMP1

Target Applications

  • Industrial HMI panels and PLCs
  • Smart home gateways and IoT hubs
  • 5G base station control units
  • Automotive dashboard and infotainment systems
  • Medical imaging and patient monitoring devices
  • Robotics and motion control systems

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for STM32MP257FAI3. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

STM32MP257FAI3 是意法半導體推出的高性能雙核微處理器,結合了 Arm Cortex-A7 雙核應用處理器和 Arm Cortex-M4 實時協處理器。該器件採用 436 球 TFBGA 封裝(18x18 mm),專為需要豐富用戶界面、實時控制和連接性的先進工業和消費應用而設計。它提供廣泛的集成外設,包括 3D GPU、MIPI-DSI 顯示接口和多種通信接口。

詳細技術參數

參數 數值
核心處理器 雙核 Arm Cortex-A7(最高 800 MHz)+ Cortex-M4(最高 209 MHz)
封裝 436-TFBGA(18x18 mm)
工作溫度 -40°C 至 +125°C
存儲器 高達 1 MB SRAM,支持外部 DDR3/DDR3L/LPDDR2
GPU Vivante GCNanoUltra 3D GPU
顯示接口 MIPI-DSI(2 通道)
攝像頭接口 並行 DCMI
連接性 2x 千兆以太網,2x USB 2.0 OTG,8x UART,5x SPI,4x I2C,SDMMC,SAI,SPDIF
安全性 安全啟動,加密加速器,TRNG
電源管理 集成 PMIC,多種低功耗模式

核心特性

  • 雙核架構支持非對稱多處理(AMP)或對稱多處理(SMP)
  • 配備 Vivante GPU 的豐富 3D 圖形,適用於 HMI 應用
  • 先進的安全特性,適用於安全的 IoT 部署
  • 寬工作溫度範圍,適用於工業環境
  • 全面的開發生態系統,支持 STM32CubeMP1

典型應用場景

  • 工業 HMI 面板和 PLC
  • 智能家居網關和 IoT 集線器
  • 5G 基站控制單元
  • 汽車儀表板和信息娛樂系統
  • 醫療成像和患者監護設備
  • 機器人和運動控制系統

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 STM32MP257FAI3 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

🔥 熱門型號推薦 / Hot Related Models:

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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