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DRA829JMTGBALFR TI Processor | 827-FCBGA(24X24) | 8-Core, 2.0GHz

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ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297 ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297
产品描述
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Product Overview

The DRA829JMTGBALFR is a high-performance system-on-chip (SoC) from Texas Instruments, designed for advanced driver assistance systems (ADAS) and gateway applications. It integrates an 8-core Arm Cortex-A72 and Cortex-R5F processor cluster, along with a dedicated deep learning accelerator, providing up to 8 TOPS of AI performance. The device is housed in a 827-FCBGA (24x24 mm) package, offering a compact solution for automotive and industrial edge computing.

Detailed Technical Specifications

Parameter Value
Processor Cores 4x Cortex-A72 @ 2.0 GHz, 4x Cortex-R5F @ 1.0 GHz
AI Accelerator Deep Learning Accelerator (8 TOPS)
Memory LPDDR4-3200, up to 8 GB
Storage Interfaces eMMC 5.1, SD/SDIO, QSPI NOR Flash
Networking 2x Gigabit Ethernet (TSN), 1x CAN-FD, 1x LIN
Display 1x DisplayPort, 1x HDMI 2.0, 1x LVDS
Camera Input 4x MIPI CSI-2 (4-lane each)
PCIe 2x PCIe Gen3 (1-lane each)
USB 2x USB 3.0, 2x USB 2.0
Package 827-FCBGA (24x24 mm)
Operating Temp -40°C to +125°C

Key Features

  • High-performance heterogeneous computing with 8 cores
  • Integrated deep learning accelerator for real-time AI inference
  • Advanced security features including HSM and secure boot
  • Support for multiple high-speed interfaces (PCIe, USB 3.0, GigE)
  • Functional safety up to ASIL-D
  • Low power consumption with dynamic voltage and frequency scaling

Target Applications

  • 5G base station control and data processing
  • Automotive ADAS domain controller (e.g., forward collision warning, lane keep assist)
  • In-vehicle infotainment and digital instrument cluster
  • Industrial edge gateway for IoT and machine vision
  • Robotics and autonomous mobile robots (AMRs)

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for DRA829JMTGBALFR. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

DRA829JMTGBALFR 是德州儀器推出的一款高性能系統級芯片(SoC),專為先進駕駛輔助系統(ADAS)和網關應用設計。它集成了8核 Arm Cortex-A72 和 Cortex-R5F 處理器集群,以及專用深度學習加速器,提供高達8 TOPS的AI性能。該器件採用827-FCBGA(24x24 mm)封裝,為汽車和工業邊緣計算提供緊湊解決方案。

詳細技術參數

參數 數值
處理器核心 4x Cortex-A72 @ 2.0 GHz, 4x Cortex-R5F @ 1.0 GHz
AI加速器 深度學習加速器 (8 TOPS)
內存 LPDDR4-3200, 最高8 GB
存儲接口 eMMC 5.1, SD/SDIO, QSPI NOR Flash
網絡 2x 千兆以太網 (TSN), 1x CAN-FD, 1x LIN
顯示 1x DisplayPort, 1x HDMI 2.0, 1x LVDS
攝像頭輸入 4x MIPI CSI-2 (4-lane each)
PCIe 2x PCIe Gen3 (1-lane each)
USB 2x USB 3.0, 2x USB 2.0
封裝 827-FCBGA (24x24 mm)
工作溫度 -40°C 至 +125°C

核心特性

  • 高性能異構計算,8核處理器
  • 集成深度學習加速器,支持實時AI推理
  • 先進安全特性,包括HSM和安全啟動
  • 支持多種高速接口(PCIe, USB 3.0, 千兆以太網)
  • 功能安全等級最高ASIL-D
  • 低功耗設計,支持動態電壓頻率調整

典型應用場景

  • 5G基站控制與數據處理
  • 汽車ADAS域控制器(如前向碰撞預警、車道保持輔助)
  • 車載信息娛樂系統和數字儀表盤
  • 工業邊緣網關,用於物聯網和機器視覺
  • 機器人和自主移動機器人(AMR)

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 DRA829JMTGBALFR 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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