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TI OMAP3503ECBBA 515-POP-FCBGA(12X12)

OMAP3503ECBBA TI Applications Processor | 515-POP-FCBGA (12X12) | ARM Cortex-A8, 600MHz

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Product Overview

The OMAP3503ECBBA is a high-performance applications processor from Texas Instruments, designed for embedded multimedia and communication applications. It integrates an ARM Cortex-A8 core with a rich set of peripherals, providing a balance of power efficiency and processing capability. Housed in a 515-ball POP-FCBGA package (12x12 mm), it is ideal for space-constrained designs requiring high integration.

Detailed Technical Specifications

Parameter Value
Core ARM Cortex-A8
Max Frequency 600 MHz
L1 Cache 32 KB I-cache / 32 KB D-cache
L2 Cache 256 KB
Graphics PowerVR SGX530 3D graphics accelerator
Video Acceleration IVA 2.2 (Imaging, Video, Audio accelerator)
Memory Interface LPDDR, DDR2, SDRAM
Package 515-POP-FCBGA (12x12 mm)
Operating Temperature -40°C to 105°C

Key Features

  • ARM Cortex-A8 core up to 600 MHz
  • PowerVR SGX530 3D graphics for rich UI
  • IVA 2.2 subsystem for HD video encode/decode
  • Integrated USB 2.0 OTG, UART, SPI, I2C, MMC/SD
  • Display controller supporting up to WXGA (1366x768)
  • Camera interface for image sensors
  • Low power consumption with multiple power domains
  • Package-on-Package (POP) memory stacking support

Target Applications

  • Portable navigation devices (PND) like Garmin nuvi
  • Automotive infotainment systems and digital clusters
  • Industrial human-machine interfaces (HMI)
  • Medical imaging and patient monitoring devices
  • Smart home gateways and control panels
  • Portable media players and e-readers

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for OMAP3503ECBBA. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

OMAP3503ECBBA 是德州儀器(TI)推出的一款高性能應用處理器,專為嵌入式多媒體和通信應用設計。它集成了 ARM Cortex-A8 核心和豐富的外設,在功耗和處理能力之間取得了平衡。採用 515 球 POP-FCBGA 封裝(12x12 mm),非常適合需要高度集成的空間受限設計。

詳細技術參數

參數 數值
核心 ARM Cortex-A8
最高頻率 600 MHz
L1 快取 32 KB 指令快取 / 32 KB 數據快取
L2 快取 256 KB
圖形加速 PowerVR SGX530 3D 圖形加速器
視頻加速 IVA 2.2(影像、視頻、音頻加速器)
記憶體介面 LPDDR、DDR2、SDRAM
封裝 515-POP-FCBGA(12x12 mm)
工作溫度 -40°C 至 105°C

核心特性

  • ARM Cortex-A8 核心,最高 600 MHz
  • PowerVR SGX530 3D 圖形,支援豐富用戶界面
  • IVA 2.2 子系統,支援高清視頻編解碼
  • 集成 USB 2.0 OTG、UART、SPI、I2C、MMC/SD
  • 顯示控制器,支援最高 WXGA(1366x768)
  • 攝像頭介面,支援圖像傳感器
  • 低功耗設計,多個電源域
  • 支持封裝疊層(POP)記憶體堆疊

典型應用場景

  • 便攜導航設備(如 Garmin nuvi)
  • 汽車信息娛樂系統和數字儀表盤
  • 工業人機界面(HMI)
  • 醫療成像和病人監護設備
  • 智能家居網關和控制面板
  • 便攜媒體播放器和電子閱讀器

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 OMAP3503ECBBA 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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獲取報價或技術手冊 / Need Batch Quote or Datasheet?

Our team provides competitive wholesale pricing for OMAP3503ECBBA.

HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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