TMS32C6713BZDPA200 TI DSP | 272-BGA (27X27) | 200MHz, Floating-Point

Product Overview

The TMS32C6713BZDPA200 is a high-performance floating-point digital signal processor (DSP) from Texas Instruments, part of the TMS320C67x generation. It operates at 200 MHz and delivers up to 1800 MFLOPS, making it ideal for demanding real-time signal processing applications. Housed in a 272-ball BGA package (27x27 mm), it offers a rich set of peripherals including two McBSPs, two MCBSPs, a 16-bit host port interface (HPI), and a 32-bit external memory interface (EMIF). The device features 256 KB of on-chip SRAM and a two-level cache architecture. Its low power consumption and high computational density make it suitable for embedded systems in telecommunications, audio processing, and industrial control.

Detailed Technical Specifications

Key Features

• High-performance floating-point DSP core with 200 MHz clock speed
• Up to 1800 MFLOPS for intensive math operations
• Two-level cache architecture for efficient data flow
• Rich peripheral set including serial ports and external memory interface
• Low-power design with multiple power-down modes
• Industrial temperature range for harsh environments
• 272-ball BGA package for compact designs

Target Applications

• 5G base station digital front-end processing
• Automotive dashboard audio and voice processing
• Industrial motor control and power inverters
• Medical imaging systems (e.g., ultrasound)
• Professional audio mixing consoles
• Radar and sonar signal processing

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for TMS32C6713BZDPA200. Our core advantages include:

• 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
• In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
• HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
• Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
• BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

• 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
• RoHS Compliant: All electronic components comply with international environmental and safety standards.
• Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

TMS32C6713BZDPA200 是德州儀器（TI）推出的一款高性能浮點數字信號處理器（DSP），屬於 TMS320C67x 系列。它工作在 200 MHz 頻率，可提供高達 1800 MFLOPS 的計算能力，非常適合要求苛刻的實時信號處理應用。該器件採用 272 球 BGA 封裝（27x27 mm），配備豐富的外設，包括兩個 McBSP、兩個 MCBSP、16 位主機端口接口（HPI）和 32 位外部存儲器接口（EMIF）。片上集成 256 KB SRAM 和二級緩存架構。其低功耗和高計算密度使其適用於電信、音頻處理和工業控制等嵌入式系統。

詳細技術參數

核心特性

• 高性能浮點 DSP 核心，時鐘頻率 200 MHz
• 高達 1800 MFLOPS 的密集數學運算能力
• 二級緩存架構，實現高效數據流
• 豐富的外設集，包括串行端口和外部存儲器接口
• 低功耗設計，支持多種省電模式
• 工業級溫度範圍，適用於惡劣環境
• 272 球 BGA 封裝，適合緊湊設計

典型應用場景

• 5G 基站數字前端處理
• 汽車儀表盤音頻和語音處理
• 工業電機控制和電源逆變器
• 醫療成像系統（如超聲）
• 專業音頻調音台
• 雷達和聲納信號處理

環球供應鏈與批發合作夥伴方案

在 Jasin Chip，我們為 TMS32C6713BZDPA200 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括：

• 全天候環球客戶支援：專業團隊為您提供即時報價及技術支援，無需漫長等待。
• 現貨庫存，即日發貨：確保現貨充足。下午 4 點前確認訂單，即可安排當天寄出。
• 深港聯動，結算靈活：深圳直發全球，物流高效可靠；支援香港銀行戶口轉賬及多幣種結算。
• Escrow 擔保交易：支援 Escrow.com 平台交易，保障買賣雙方權益，小批量訂單亦可安心在線下單。
• BOM 配單與樣板服務：提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨，具備完善的品質保證及產品可追溯性。

• 100% 原廠正貨：承諾所有供應零件均為原裝現貨，品質嚴格把關，來源清晰可追溯。
• 符合 RoHS 認證：所有電子元器件均符合國際環保標準及相關安全認證。
• 原廠封裝保護：嚴格保留原廠原始包裝及封條，確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨，提供 BOM 配單及現貨庫存支援，歡迎查詢。

HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]