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CY7C25442KV18-333BZI Infineon SRAM | 165-FBGA (13X15) | 333MHz, 72Mb

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ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297 ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297
产品描述
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Product Overview

The CY7C25442KV18-333BZI is a high-performance 72Mb (2M x 36) synchronous SRAM from Infineon, designed for networking and telecommunications applications. It operates at 333 MHz with a QDR-IV architecture, providing extremely high data bandwidth. The device is housed in a compact 165-ball FBGA package (13x15 mm) and operates over an industrial temperature range (-40°C to +85°C). It features separate independent read and write ports, each with its own address and control lines, enabling simultaneous read and write operations.

Detailed Technical Specifications

Parameter Value
Part Number CY7C25442KV18-333BZI
Manufacturer Infineon Technologies
Memory Type QDR-IV SRAM
Memory Size 72 Mb (2M x 36)
Clock Frequency 333 MHz
Data Rate 667 Mbps per pin (DDR)
Supply Voltage 1.35V (VDD) / 1.8V (VDDQ)
Interface QDR-IV (Separate read/write ports)
Package 165-FBGA (13x15 mm)
Operating Temperature -40°C to +85°C
RoHS Compliant

Key Features

  • QDR-IV architecture with separate read and write ports
  • 333 MHz clock frequency with DDR data transfer
  • 72 Mb density in a 2M x 36 configuration
  • Low power consumption with 1.35V core and 1.8V I/O
  • On-chip DLL for precise timing
  • Programmable impedance output drivers
  • Industrial temperature range support
  • Compact 165-ball FBGA package (13x15 mm)

Target Applications

  • 5G base stations (e.g., massive MIMO beamforming)
  • Network switches and routers (e.g., Cisco Nexus 9000)
  • High-performance computing (HPC) clusters
  • Telecommunications equipment (e.g., optical transport networks)
  • Automotive advanced driver-assistance systems (ADAS) like radar processing
  • Test and measurement equipment (e.g., oscilloscopes)

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for CY7C25442KV18-333BZI. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

CY7C25442KV18-333BZI 是英飛凌推出的一款高性能 72Mb(2M x 36)同步 SRAM,專為網絡和電信應用設計。它採用 QDR-IV 架構,工作頻率為 333 MHz,可提供極高的數據帶寬。該器件採用緊湊的 165 球 FBGA 封裝(13x15 mm),並支持工業溫度範圍(-40°C 至 +85°C)。它具有獨立的讀寫端口,每個端口都有自己的地址和控制線,從而實現同時讀寫操作。

詳細技術參數

參數 數值
型號 CY7C25442KV18-333BZI
製造商 英飛凌科技
存儲類型 QDR-IV SRAM
存儲容量 72 Mb(2M x 36)
時鐘頻率 333 MHz
數據速率 每引腳 667 Mbps(DDR)
供電電壓 1.35V(VDD)/ 1.8V(VDDQ)
接口 QDR-IV(獨立讀寫端口)
封裝 165-FBGA(13x15 mm)
工作溫度 -40°C 至 +85°C
RoHS 符合

核心特性

  • QDR-IV 架構,具有獨立的讀寫端口
  • 333 MHz 時鐘頻率,DDR 數據傳輸
  • 72 Mb 密度,配置為 2M x 36
  • 低功耗,核心電壓 1.35V,I/O 電壓 1.8V
  • 片內 DLL 實現精確時序
  • 可編程阻抗輸出驅動器
  • 支持工業溫度範圍
  • 緊湊的 165 球 FBGA 封裝(13x15 mm)

典型應用場景

  • 5G 基站(例如大規模 MIMO 波束成形)
  • 網絡交換機和路由器(例如 Cisco Nexus 9000)
  • 高性能計算(HPC)集群
  • 電信設備(例如光傳輸網絡)
  • 汽車高級駕駛輔助系統(ADAS),如雷達處理
  • 測試和測量設備(例如示波器)

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 CY7C25442KV18-333BZI 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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