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CY7C2564XV18-366BZXC Infineon SRAM | 165-FBGA (13X15) | 36Mbit, 366MHz, 1.8V

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ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297 ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297
产品描述
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Product Overview

The CY7C2564XV18-366BZXC is a high-performance 36-Mbit synchronous SRAM from Infineon, organized as 2M words by 18 bits. It operates with a 1.8V core power supply and features a 366 MHz clock speed, delivering fast access times and high bandwidth for demanding applications. The device is housed in a compact 165-ball FBGA package (13x15 mm), making it suitable for space-constrained designs. It supports DDR-II+ (Double Data Rate) architecture with read and write operations on both clock edges, effectively doubling data throughput. The CY7C2564XV18-366BZXC is ideal for networking, telecommunications, and high-speed computing systems requiring reliable and efficient memory solutions.

Detailed Technical Specifications

Parameter Value
Density 36 Mbit
Organization 2M x 18
Supply Voltage (Vdd) 1.7V – 1.9V (nominal 1.8V)
Clock Frequency 366 MHz
Access Time 2.7 ns (typical)
Interface DDR-II+ (QDR-II+ compatible)
Package 165-ball FBGA (13x15 mm)
Operating Temperature 0°C to +70°C (commercial)
RoHS Compliant Yes

Key Features

  • High-speed 366 MHz clock operation with DDR-II+ architecture
  • 36 Mbit density in a 2M x 18 configuration
  • Low-voltage core: 1.8V nominal (1.7V to 1.9V)
  • Separate read and write ports for simultaneous operations
  • On-chip DLL for precise timing control
  • Programmable impedance output drivers
  • IEEE 1149.1 JTAG boundary scan
  • Lead-free and RoHS compliant

Target Applications

  • 5G base stations (e.g., massive MIMO beamforming processors)
  • Network switches and routers (e.g., Cisco 9000 series line cards)
  • High-performance computing (e.g., FPGA-based accelerators)
  • Telecommunications infrastructure (e.g., optical transport networks)
  • Automotive advanced driver-assistance systems (ADAS) (e.g., radar processing units)
  • Industrial automation (e.g., real-time control systems)

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for CY7C2564XV18-366BZXC. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

CY7C2564XV18-366BZXC 是英飛凌推出的一款高性能 36 Mbit 同步 SRAM,組織為 2M 字 × 18 位元。它採用 1.8V 核心電源供電,工作時脈高達 366 MHz,提供快速的存取時間和高頻寬,適用於要求嚴苛的應用。該器件採用緊湊的 165 球 FBGA 封裝(13×15 mm),適合空間受限的設計。它支援 DDR-II+(雙倍數據速率)架構,在時脈的上升沿和下降沿均可進行讀寫操作,有效提升數據吞吐量。CY7C2564XV18-366BZXC 非常適合需要可靠高效記憶體解決方案的網路、電信和高速計算系統。

詳細技術參數

參數 數值
密度 36 Mbit
組織 2M x 18
電源電壓 (Vdd) 1.7V – 1.9V(標稱 1.8V)
時脈頻率 366 MHz
存取時間 2.7 ns(典型值)
介面 DDR-II+(相容 QDR-II+)
封裝 165-ball FBGA(13×15 mm)
工作溫度 0°C 至 +70°C(商業級)
RoHS 合規

核心特性

  • 高速 366 MHz 時脈操作,DDR-II+ 架構
  • 36 Mbit 密度,2M x 18 配置
  • 低電壓核心:1.8V 標稱(1.7V 至 1.9V)
  • 獨立的讀寫埠,支援同時操作
  • 片內 DLL 實現精確時序控制
  • 可程式輸出阻抗驅動器
  • IEEE 1149.1 JTAG 邊界掃描
  • 無鉛且符合 RoHS 標準

典型應用場景

  • 5G 基地台(例如大規模 MIMO 波束成形處理器)
  • 網路交換機和路由器(例如 Cisco 9000 系列線卡)
  • 高性能計算(例如基於 FPGA 的加速器)
  • 電信基礎設施(例如光傳輸網路)
  • 汽車先進駕駛輔助系統(ADAS)(例如雷達處理單元)
  • 工業自動化(例如即時控制系統)

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 CY7C2564XV18-366BZXC 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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