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CYUSB3012-BZXC Infineon USB Controller | 121-FBGA(10X10) | USB 3.0, 32-bit ARM926EJ-S

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产品描述
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Product Overview

The CYUSB3012-BZXC is a high-performance USB 3.0 peripheral controller from Infineon (formerly Cypress Semiconductor), part of the EZ-USB FX3 family. It integrates a 32-bit ARM926EJ-S microprocessor running at up to 200 MHz, providing a flexible and programmable solution for high-speed data transfer. Housed in a compact 121-ball FBGA package (10x10 mm), it is ideal for applications requiring USB 3.0 SuperSpeed connectivity with custom firmware capabilities.

Detailed Technical Specifications

Parameter Value
Part Number CYUSB3012-BZXC
Manufacturer Infineon Technologies
Package 121-FBGA (10x10 mm)
USB Standard USB 3.0 SuperSpeed (5 Gbps)
Core Processor ARM926EJ-S, 32-bit, up to 200 MHz
SRAM 512 KB
GPIO Up to 59 programmable I/Os
Interfaces I2C, SPI, UART, I2S, CAN, SDIO, etc.
Operating Temperature 0°C to +70°C
Supply Voltage 1.2V core, 3.3V I/O

Key Features

  • USB 3.0 SuperSpeed (5 Gbps) with backward compatibility to USB 2.0/1.1
  • Programmable ARM926EJ-S core for custom data processing
  • 512 KB on-chip SRAM for firmware and data buffering
  • Flexible GPIF II interface for connection to external processors, FPGAs, or ASICs
  • Multiple serial interfaces: I2C, SPI, UART, I2S, CAN, SDIO
  • Integrated USB PHY and PLL
  • Low power consumption with multiple power modes
  • Compact 121-ball FBGA package (10x10 mm) for space-constrained designs

Target Applications

  • 5G base station control and data acquisition
  • Automotive dashboard and infotainment systems
  • Industrial cameras and machine vision
  • Medical imaging devices (e.g., ultrasound, endoscopy)
  • High-speed data loggers and test equipment
  • FPGA configuration and data streaming
  • Printers and scanners
  • Video capture and surveillance systems

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for CYUSB3012-BZXC. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

CYUSB3012-BZXC 是英飛凌(原賽普拉斯半導體)EZ-USB FX3 系列的一款高性能 USB 3.0 外設控制器。它集成了一個運行頻率高達 200 MHz 的 32 位 ARM926EJ-S 微處理器,為高速數據傳輸提供了靈活且可編程的解決方案。採用緊湊的 121 球 FBGA 封裝(10x10 mm),非常適合需要 USB 3.0 SuperSpeed 連接和自定義固件能力的應用。

詳細技術參數

參數 數值
型號 CYUSB3012-BZXC
製造商 英飛凌科技
封裝 121-FBGA (10x10 mm)
USB 標準 USB 3.0 SuperSpeed (5 Gbps)
核心處理器 ARM926EJ-S, 32位, 最高 200 MHz
SRAM 512 KB
GPIO 最多 59 個可編程 I/O
接口 I2C, SPI, UART, I2S, CAN, SDIO 等
工作溫度 0°C 至 +70°C
供電電壓 1.2V 核心, 3.3V I/O

核心特性

  • USB 3.0 SuperSpeed (5 Gbps),向後兼容 USB 2.0/1.1
  • 可編程 ARM926EJ-S 核心,用於自定義數據處理
  • 512 KB 片上 SRAM,用於固件和數據緩衝
  • 靈活的 GPIF II 接口,可連接外部處理器、FPGA 或 ASIC
  • 多種串行接口:I2C, SPI, UART, I2S, CAN, SDIO
  • 集成 USB PHY 和 PLL
  • 低功耗,支持多種功耗模式
  • 緊湊的 121 球 FBGA 封裝 (10x10 mm),適合空間受限的設計

典型應用場景

  • 5G 基站控制與數據採集
  • 汽車儀表盤與信息娛樂系統
  • 工業相機與機器視覺
  • 醫療成像設備(如超聲、內窺鏡)
  • 高速數據記錄儀與測試設備
  • FPGA 配置與數據流傳輸
  • 打印機與掃描儀
  • 視頻採集與監控系統

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 CYUSB3012-BZXC 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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