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Product Overview
The CYUSB3014-BZXI is a high-performance USB 3.0 peripheral controller from Infineon (formerly Cypress), part of the EZ-USB FX3 family. It integrates a 32-bit ARM926EJ-S microprocessor running at up to 200 MHz, providing a flexible and powerful solution for applications requiring high-speed data transfer. The device is housed in a compact 121-ball FBGA package (10x10 mm) and supports USB SuperSpeed (5 Gbps) with 32 endpoints. It features a fully configurable architecture with GPIF II interface for connecting to external processors, FPGAs, or image sensors. The CYUSB3014-BZXI is ideal for applications such as industrial cameras, medical imaging, test equipment, and data acquisition systems.
Detailed Technical Specifications
| Parameter |
Value |
| Part Number |
CYUSB3014-BZXI |
| Brand |
Infineon |
| Package |
121-FBGA (10x10 mm) |
| USB Compliance |
USB 3.0 SuperSpeed (5 Gbps) |
| CPU Core |
32-bit ARM926EJ-S, up to 200 MHz |
| SRAM |
512 KB |
| GPIF II |
16-bit/32-bit parallel interface, up to 100 MHz |
| Number of Endpoints |
32 (configurable) |
| Operating Temperature |
-40°C to +85°C (industrial) |
| Supply Voltage |
1.2V core, 3.3V I/O |
| Additional Interfaces |
I2C, SPI, UART, GPIOs |
Key Features
- USB 3.0 SuperSpeed (5 Gbps) with backward compatibility to USB 2.0/1.1
- 32-bit ARM926EJ-S processor for on-chip data processing
- 512 KB embedded SRAM for firmware and data buffering
- GPIF II interface for glueless connection to external devices
- 32 configurable endpoints for flexible data streaming
- Industrial temperature range (-40°C to +85°C)
- Small footprint 121-FBGA package (10x10 mm)
- Comprehensive software support including SDK and example codes
Target Applications
- Industrial cameras and machine vision systems (e.g., Basler ace series)
- Medical imaging devices (e.g., ultrasound probes, endoscopes)
- Test and measurement equipment (e.g., oscilloscopes, logic analyzers)
- Data acquisition systems (e.g., NI DAQ modules)
- 5G base station control and monitoring interfaces
- Automotive dashboard and infotainment systems
- FPGA-based prototyping and development platforms
Global Supply Chain & Wholesale Solutions
At Jasin Chip, we provide professional supply chain and wholesale solutions for
CYUSB3014-BZXI. Our core advantages include:
-
24/7 Global Customer Support: Professional team providing instant
quotes and technical support worldwide.
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In-stock Inventory, Same-day Shipping: We maintain localized stock;
orders confirmed before 4 PM are shipped the same day.
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HK-SZ Synergy, Flexible Settlement: Direct global shipping from
Shenzhen with support for HK bank transfers and multi-currency.
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Escrow Secured Transactions: We support Escrow.com for secure
transactions, ensuring peace of mind for batch orders.
-
BOM Kitting & Sampling Services: Specialized sourcing for
testing samples and urgent shortage components.
Quality Assurance & Compliance
Jasin Chip guarantees that all delivered products are 100% original factory stock
with full quality assurance and traceability.
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100% Original & Authentic: All components are guaranteed to
be authentic with strict quality control.
-
RoHS Compliant: All electronic components comply with international
environmental and safety standards.
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Original Factory Packaging: We maintain original factory packaging
and seals to ensure ESD protection and physical integrity.
產品概述
CYUSB3014-BZXI 是英飛凌(原賽普拉斯)推出的高性能 USB 3.0 週邊控制器,屬於 EZ-USB FX3 系列。它整合了一個 32 位元 ARM926EJ-S 微處理器,運行頻率最高可達 200 MHz,為需要高速數據傳輸的應用提供了靈活且強大的解決方案。該器件採用緊湊的 121 球 FBGA 封裝(10x10 mm),支援 USB SuperSpeed(5 Gbps)並具有 32 個端點。它配備了完全可配置的 GPIF II 接口,用於連接外部處理器、FPGA 或圖像傳感器。CYUSB3014-BZXI 非常適合工業相機、醫療成像、測試設備和數據採集系統等應用。
詳細技術參數
| 參數 |
數值 |
| 型號 |
CYUSB3014-BZXI |
| 品牌 |
Infineon |
| 封裝 |
121-FBGA(10x10 mm) |
| USB 標準 |
USB 3.0 SuperSpeed(5 Gbps) |
| CPU 核心 |
32 位元 ARM926EJ-S,最高 200 MHz |
| SRAM |
512 KB |
| GPIF II |
16 位元/32 位元並行接口,最高 100 MHz |
| 端點數量 |
32(可配置) |
| 工作溫度 |
-40°C 至 +85°C(工業級) |
| 供電電壓 |
核心 1.2V,I/O 3.3V |
| 其他接口 |
I2C、SPI、UART、GPIO |
核心特性
- USB 3.0 SuperSpeed(5 Gbps),向下相容 USB 2.0/1.1
- 32 位元 ARM926EJ-S 處理器,支援片上數據處理
- 512 KB 嵌入式 SRAM,用於韌體和數據緩衝
- GPIF II 接口,可無縫連接外部設備
- 32 個可配置端點,實現靈活的數據串流
- 工業級溫度範圍(-40°C 至 +85°C)
- 小巧的 121-FBGA 封裝(10x10 mm)
- 全面的軟體支援,包括 SDK 和範例代碼
典型應用場景
- 工業相機和機器視覺系統(例如 Basler ace 系列)
- 醫療成像設備(例如超聲探頭、內窺鏡)
- 測試與測量設備(例如示波器、邏輯分析儀)
- 數據採集系統(例如 NI DAQ 模塊)
- 5G 基站控制與監控接口
- 汽車儀表板與信息娛樂系統
- FPGA 原型設計與開發平台
環球供應鏈與批發合作夥伴方案
在 Jasin Chip,我們為 CYUSB3014-BZXI 提供全面的供應鏈與批發解決方案。
我們的核心優勢包括:
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全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
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