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CYUSB3014-BZXI Infineon USB Controller | 121-FBGA(10X10) | USB 3.0, 32-bit ARM926EJ-S

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产品描述
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Product Overview

The CYUSB3014-BZXI is a high-performance USB 3.0 peripheral controller from Infineon (formerly Cypress), part of the EZ-USB FX3 family. It integrates a 32-bit ARM926EJ-S microprocessor running at up to 200 MHz, providing a flexible and powerful solution for applications requiring high-speed data transfer. The device is housed in a compact 121-ball FBGA package (10x10 mm) and supports USB SuperSpeed (5 Gbps) with 32 endpoints. It features a fully configurable architecture with GPIF II interface for connecting to external processors, FPGAs, or image sensors. The CYUSB3014-BZXI is ideal for applications such as industrial cameras, medical imaging, test equipment, and data acquisition systems.

Detailed Technical Specifications

Parameter Value
Part Number CYUSB3014-BZXI
Brand Infineon
Package 121-FBGA (10x10 mm)
USB Compliance USB 3.0 SuperSpeed (5 Gbps)
CPU Core 32-bit ARM926EJ-S, up to 200 MHz
SRAM 512 KB
GPIF II 16-bit/32-bit parallel interface, up to 100 MHz
Number of Endpoints 32 (configurable)
Operating Temperature -40°C to +85°C (industrial)
Supply Voltage 1.2V core, 3.3V I/O
Additional Interfaces I2C, SPI, UART, GPIOs

Key Features

  • USB 3.0 SuperSpeed (5 Gbps) with backward compatibility to USB 2.0/1.1
  • 32-bit ARM926EJ-S processor for on-chip data processing
  • 512 KB embedded SRAM for firmware and data buffering
  • GPIF II interface for glueless connection to external devices
  • 32 configurable endpoints for flexible data streaming
  • Industrial temperature range (-40°C to +85°C)
  • Small footprint 121-FBGA package (10x10 mm)
  • Comprehensive software support including SDK and example codes

Target Applications

  • Industrial cameras and machine vision systems (e.g., Basler ace series)
  • Medical imaging devices (e.g., ultrasound probes, endoscopes)
  • Test and measurement equipment (e.g., oscilloscopes, logic analyzers)
  • Data acquisition systems (e.g., NI DAQ modules)
  • 5G base station control and monitoring interfaces
  • Automotive dashboard and infotainment systems
  • FPGA-based prototyping and development platforms

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for CYUSB3014-BZXI. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

CYUSB3014-BZXI 是英飛凌(原賽普拉斯)推出的高性能 USB 3.0 週邊控制器,屬於 EZ-USB FX3 系列。它整合了一個 32 位元 ARM926EJ-S 微處理器,運行頻率最高可達 200 MHz,為需要高速數據傳輸的應用提供了靈活且強大的解決方案。該器件採用緊湊的 121 球 FBGA 封裝(10x10 mm),支援 USB SuperSpeed(5 Gbps)並具有 32 個端點。它配備了完全可配置的 GPIF II 接口,用於連接外部處理器、FPGA 或圖像傳感器。CYUSB3014-BZXI 非常適合工業相機、醫療成像、測試設備和數據採集系統等應用。

詳細技術參數

參數 數值
型號 CYUSB3014-BZXI
品牌 Infineon
封裝 121-FBGA(10x10 mm)
USB 標準 USB 3.0 SuperSpeed(5 Gbps)
CPU 核心 32 位元 ARM926EJ-S,最高 200 MHz
SRAM 512 KB
GPIF II 16 位元/32 位元並行接口,最高 100 MHz
端點數量 32(可配置)
工作溫度 -40°C 至 +85°C(工業級)
供電電壓 核心 1.2V,I/O 3.3V
其他接口 I2C、SPI、UART、GPIO

核心特性

  • USB 3.0 SuperSpeed(5 Gbps),向下相容 USB 2.0/1.1
  • 32 位元 ARM926EJ-S 處理器,支援片上數據處理
  • 512 KB 嵌入式 SRAM,用於韌體和數據緩衝
  • GPIF II 接口,可無縫連接外部設備
  • 32 個可配置端點,實現靈活的數據串流
  • 工業級溫度範圍(-40°C 至 +85°C)
  • 小巧的 121-FBGA 封裝(10x10 mm)
  • 全面的軟體支援,包括 SDK 和範例代碼

典型應用場景

  • 工業相機和機器視覺系統(例如 Basler ace 系列)
  • 醫療成像設備(例如超聲探頭、內窺鏡)
  • 測試與測量設備(例如示波器、邏輯分析儀)
  • 數據採集系統(例如 NI DAQ 模塊)
  • 5G 基站控制與監控接口
  • 汽車儀表板與信息娛樂系統
  • FPGA 原型設計與開發平台

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 CYUSB3014-BZXI 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
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以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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