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Product Overview
The Infineon S70FL01GSAGBHBC10 is a high-density 1Gb (128MB) NOR Flash memory device designed for reliable code and data storage in embedded systems. Packaged in a compact 24-ball BGA (8x6mm), it operates at a supply voltage of 2.7V to 3.6V and supports standard SPI, Dual SPI, and Quad SPI interfaces for flexible and high-speed data transfer. This device is ideal for applications requiring fast read performance, low power consumption, and long-term data retention.
Detailed Technical Specifications
| Parameter |
Value |
| Density |
1 Gb (128 MB) |
| Interface |
SPI / Dual SPI / Quad SPI |
| Supply Voltage |
2.7V – 3.6V |
| Max Clock Frequency |
104 MHz |
| Read Current (Active) |
25 mA (typ) |
| Standby Current |
50 µA (typ) |
| Temperature Range |
-40°C to +85°C |
| Package |
24-Ball BGA (8x6 mm) |
| Data Retention |
20 years |
| Endurance |
100,000 program/erase cycles |
Key Features
- High-density 1Gb NOR Flash for code shadowing and data storage
- Quad SPI interface with up to 104 MHz clock for fast read throughput
- Low power consumption: 25 mA active read, 50 µA standby
- Wide operating temperature range (-40°C to +85°C)
- Reliable data retention of 20 years and 100k endurance cycles
- Compact 24-BGA (8x6mm) package for space-constrained designs
- Supports legacy SPI, Dual SPI, and Quad SPI modes
Target Applications
- 5G base stations: for boot code and firmware storage
- Automotive dashboard: for graphics and code storage
- Industrial IoT gateways: for configuration and log data
- Networking equipment: routers, switches for firmware
- Smart home hubs: for operating system and application code
Global Supply Chain & Wholesale Solutions
At Jasin Chip, we provide professional supply chain and wholesale solutions for
S70FL01GSAGBHBC10. Our core advantages include:
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24/7 Global Customer Support: Professional team providing instant
quotes and technical support worldwide.
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In-stock Inventory, Same-day Shipping: We maintain localized stock;
orders confirmed before 4 PM are shipped the same day.
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HK-SZ Synergy, Flexible Settlement: Direct global shipping from
Shenzhen with support for HK bank transfers and multi-currency.
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Escrow Secured Transactions: We support Escrow.com for secure
transactions, ensuring peace of mind for batch orders.
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BOM Kitting & Sampling Services: Specialized sourcing for
testing samples and urgent shortage components.
Quality Assurance & Compliance
Jasin Chip guarantees that all delivered products are 100% original factory stock
with full quality assurance and traceability.
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100% Original & Authentic: All components are guaranteed to
be authentic with strict quality control.
-
RoHS Compliant: All electronic components comply with international
environmental and safety standards.
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Original Factory Packaging: We maintain original factory packaging
and seals to ensure ESD protection and physical integrity.
產品概述
英飛凌 S70FL01GSAGBHBC10 是一款高密度 1Gb(128MB)NOR Flash 存儲器件,專為嵌入式系統中的可靠代碼和數據存儲而設計。它採用緊湊的 24 球 BGA(8x6mm)封裝,工作電壓範圍為 2.7V 至 3.6V,支持標準 SPI、Dual SPI 和 Quad SPI 接口,以實現靈活的高速數據傳輸。該器件非常適合需要快速讀取性能、低功耗和長期數據保留的應用。
詳細技術參數
| 參數 |
數值 |
| 密度 |
1 Gb(128 MB) |
| 接口 |
SPI / Dual SPI / Quad SPI |
| 供電電壓 |
2.7V – 3.6V |
| 最大時鐘頻率 |
104 MHz |
| 讀取電流(工作) |
25 mA(典型) |
| 待機電流 |
50 µA(典型) |
| 溫度範圍 |
-40°C 至 +85°C |
| 封裝 |
24-Ball BGA(8x6 mm) |
| 數據保留 |
20 年 |
| 耐久性 |
100,000 次編程/擦除循環 |
核心特性
- 高密度 1Gb NOR Flash,用於代碼映射和數據存儲
- Quad SPI 接口,最高 104 MHz 時鐘,實現快速讀取吞吐量
- 低功耗:25 mA 工作讀取,50 µA 待機
- 寬工作溫度範圍(-40°C 至 +85°C)
- 可靠的 20 年數據保留和 10 萬次耐久性循環
- 緊湊的 24-BGA(8x6mm)封裝,適合空間受限的設計
- 支持傳統 SPI、Dual SPI 和 Quad SPI 模式
典型應用場景
- 5G 基站:用於啟動代碼和固件存儲
- 汽車儀表盤:用於圖形和代碼存儲
- 工業物聯網網關:用於配置和日誌數據
- 網絡設備:路由器、交換機的固件
- 智能家居中樞:用於操作系統和應用程序代碼
環球供應鏈與批發合作夥伴方案
在 Jasin Chip,我們為 S70FL01GSAGBHBC10 提供全面的供應鏈與批發解決方案。
我們的核心優勢包括:
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全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
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Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。
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原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。
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