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SLB9673XU20FW2613XTMA1 Infineon TPM 2.0 | PG-UQFN-32-1 | SPI Interface, 20MHz

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ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297 ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297
产品描述
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Product Overview

The SLB9673XU20FW2613XTMA1 is a dedicated Trusted Platform Module (TPM) 2.0 from Infineon, designed to provide robust hardware-based security for embedded systems. Housed in a compact PG-UQFN-32-1 package, this device integrates a secure microcontroller with cryptographic accelerators, ensuring tamper-resistant storage of keys, certificates, and sensitive data. It supports the latest TCG TPM 2.0 specification and communicates via a standard SPI interface, making it ideal for applications requiring high security and low power consumption.

Detailed Technical Specifications

Parameter Value
Part Number SLB9673XU20FW2613XTMA1
Brand Infineon
Package PG-UQFN-32-1
TPM Version 2.0
Interface SPI (Serial Peripheral Interface)
Max SPI Clock 20 MHz
Supply Voltage 1.8V / 3.3V
Operating Temperature -40°C to +85°C
Security Features ECC, RSA, SHA-256, AES, HMAC, NIST SP 800-90A DRBG
Certifications Common Criteria EAL4+, FIPS 140-2 Level 2

Key Features

  • Full TCG TPM 2.0 compliance with latest specification
  • Hardware-based secure key generation and storage
  • Support for asymmetric cryptography (RSA up to 2048-bit, ECC up to 256-bit)
  • On-chip symmetric encryption (AES-128/256)
  • Secure hash algorithms (SHA-1, SHA-256)
  • True Random Number Generator (TRNG) with NIST SP 800-90A
  • Low power consumption: < 1 µA in sleep mode
  • Small footprint: 5mm x 5mm UQFN package
  • Extended temperature range for industrial applications

Target Applications

  • 5G base stations: secure boot and firmware integrity verification
  • Automotive dashboards: secure OTA updates and key management
  • Industrial IoT gateways: device authentication and data encryption
  • Network routers and switches: trusted platform root of trust
  • Medical devices: patient data protection and compliance
  • Smart grid infrastructure: secure communication and metering

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for SLB9673XU20FW2613XTMA1. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

SLB9673XU20FW2613XTMA1 是英飛凌專用的可信平台模塊 (TPM 2.0),專為嵌入式系統提供強大的硬件級安全保護。採用緊湊的 PG-UQFN-32-1 封裝,集成安全微控制器和密碼加速器,確保密鑰、證書和敏感數據的防篡改存儲。支持最新的 TCG TPM 2.0 規範,通過標準 SPI 接口通信,非常適合需要高安全性和低功耗的應用。

詳細技術參數

參數 數值
型號 SLB9673XU20FW2613XTMA1
品牌 Infineon
封裝 PG-UQFN-32-1
TPM 版本 2.0
接口 SPI(串行外設接口)
最大 SPI 時鐘 20 MHz
供電電壓 1.8V / 3.3V
工作溫度 -40°C 至 +85°C
安全特性 ECC、RSA、SHA-256、AES、HMAC、NIST SP 800-90A DRBG
認證 Common Criteria EAL4+、FIPS 140-2 Level 2

核心特性

  • 完全符合 TCG TPM 2.0 最新規範
  • 硬件級安全密鑰生成和存儲
  • 支持非對稱加密(RSA 最高 2048 位,ECC 最高 256 位)
  • 片上對稱加密(AES-128/256)
  • 安全哈希算法(SHA-1、SHA-256)
  • 真隨機數發生器(TRNG),符合 NIST SP 800-90A
  • 低功耗:休眠模式 < 1 µA
  • 小尺寸:5mm x 5mm UQFN 封裝
  • 擴展溫度範圍,適用於工業應用

典型應用場景

  • 5G 基站:安全啟動和固件完整性驗證
  • 汽車儀表板:安全 OTA 更新和密鑰管理
  • 工業物聯網網關:設備認證和數據加密
  • 網絡路由器和交換機:可信平台信任根
  • 醫療設備:患者數據保護和合規性
  • 智能電網基礎設施:安全通信和計量

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 SLB9673XU20FW2613XTMA1 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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