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DM3730CBP TI Application Processor | 515-POP-FCBGA (12x12) | 1GHz ARM Cortex-A8, 800MHz DSP

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STM32F103C8T6NE555PLM358DRESP32-WROOM-32TL431AIDBZRAMS1117-3.3LM7805MAX3232CSEPC817CTPS5430DDAR STM32F103C8T6NE555PLM358DRESP32-WROOM-32TL431AIDBZRAMS1117-3.3LM7805MAX3232CSEPC817CTPS5430DDAR
1N40072N2222IRFZ44NFGA25N120S8050M7(1N4007)SS14TIP122AO3400IKW40N120H3 1N40072N2222IRFZ44NFGA25N120S8050M7(1N4007)SS14TIP122AO3400IKW40N120H3
ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297 ATMEGA328P-AUESP8266-12ELM2596S-ADJBC547BIRLZ44NMCP2515-I/STSN65HVD230AD8232L293DTDA7297
产品描述
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Product Overview

The DM3730CBP from Texas Instruments is a high-performance, low-power applications processor based on the ARM Cortex-A8 core and a TMS320C64x+ DSP core. It is designed for embedded applications requiring rich multimedia, connectivity, and real-time processing. The device integrates a 3D graphics accelerator, video accelerators, and a comprehensive set of peripherals, making it ideal for portable and fixed systems. The package is a 515-ball POP-FCBGA (12x12 mm) that supports stacked memory for compact designs.

Detailed Technical Specifications

Parameter Value
Core Processor ARM Cortex-A8
Core Frequency Up to 1 GHz
DSP Core TMS320C64x+ @ 800 MHz
Graphics Acceleration PowerVR SGX530 3D graphics
Video Acceleration IVA 2.2 (H.264, MPEG-4, etc.)
Memory Interface LPDDR/DDR2, NAND/NOR Flash
Package 515-POP-FCBGA (12x12 mm)
Operating Temperature -40°C to +105°C
Supply Voltage 1.1V core, 1.8V/3.3V I/O

Key Features

  • Dual-core architecture: ARM Cortex-A8 for general-purpose computing and C64x+ DSP for signal processing.
  • Integrated PowerVR SGX530 3D graphics accelerator for advanced user interfaces.
  • IVA 2.2 hardware video accelerator supporting multiple codecs up to 720p.
  • Rich peripheral set: USB 2.0 OTG, UART, SPI, I2C, MMC/SD, Ethernet MAC, and more.
  • Low power consumption with multiple power domains and dynamic voltage/frequency scaling.
  • POP (Package-on-Package) support for compact memory stacking.

Target Applications

  • Portable navigation devices (PND) and GPS systems.
  • Automotive infotainment and dashboard displays.
  • Industrial control and human-machine interfaces (HMI).
  • Medical imaging and patient monitoring equipment.
  • 5G base station control and management modules.
  • Smart home gateways and IoT edge devices.

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for DM3730CBP. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

DM3730CBP 是德州儀器推出的高性能、低功耗應用處理器,基於 ARM Cortex-A8 核心和 TMS320C64x+ DSP 核心。該器件專為需要豐富多媒體、連接性和實時處理的嵌入式應用而設計。它集成了 3D 圖形加速器、視頻加速器和全面的外設,非常適合便攜式和固定係統。封裝為 515 球 POP-FCBGA(12x12 mm),支持堆疊存儲器以實現緊湊設計。

詳細技術參數

參數 數值
核心處理器 ARM Cortex-A8
核心頻率 高達 1 GHz
DSP 核心 TMS320C64x+ @ 800 MHz
圖形加速 PowerVR SGX530 3D 圖形
視頻加速 IVA 2.2(H.264、MPEG-4 等)
存儲器接口 LPDDR/DDR2、NAND/NOR Flash
封裝 515-POP-FCBGA(12x12 mm)
工作溫度 -40°C 至 +105°C
供電電壓 1.1V 核心,1.8V/3.3V I/O

核心特性

  • 雙核架構:ARM Cortex-A8 用於通用計算,C64x+ DSP 用於信號處理。
  • 集成 PowerVR SGX530 3D 圖形加速器,支持高級用戶界面。
  • IVA 2.2 硬件視頻加速器,支持多種編解碼器,最高 720p。
  • 豐富的外設:USB 2.0 OTG、UART、SPI、I2C、MMC/SD、以太網 MAC 等。
  • 低功耗設計,多個電源域和動態電壓/頻率調節。
  • 支持 POP(封裝疊封)以實現緊湊的存儲器堆疊。

典型應用場景

  • 便攜式導航設備(PND)和 GPS 系統。
  • 汽車信息娛樂系統和儀表板顯示。
  • 工業控制和人性化界面(HMI)。
  • 醫療成像和病人監護設備。
  • 5G 基站控制和管理模塊。
  • 智能家居網關和 IoT 邊緣設備。

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 DM3730CBP 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

  • 100% 原廠正貨:承諾所有供應零件均為原裝現貨,品質嚴格把關,來源清晰可追溯。
  • 符合 RoHS 認證:所有電子元器件均符合國際環保標準及相關安全認證。
  • 原廠封裝保護:嚴格保留原廠原始包裝及封條,確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨,提供 BOM 配單及現貨庫存支援,歡迎查詢。

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Our team provides competitive wholesale pricing for DM3730CBP.

HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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