OMAP3530ECBBA TI Application Processor | 515-POP-FCBGA (12x12) | ARM Cortex-A8, TMS320C64x+ DSP

Product Overview

The OMAP3530ECBBA from Texas Instruments is a high-performance, low-power applications processor based on the OMAP™ 3 architecture. It integrates an ARM Cortex-A8 core with a TMS320C64x+ DSP, providing a powerful platform for multimedia and graphics-intensive applications. The device is housed in a 515-ball POP-FCBGA package (12x12 mm) and is designed for embedded systems requiring high processing efficiency and rich feature integration.

Detailed Technical Specifications

Key Features

• Dual-core architecture: ARM Cortex-A8 for general-purpose computing and C64x+ DSP for signal processing
• Integrated PowerVR SGX530 GPU for 2D/3D graphics acceleration
• IVA 2.2 hardware video accelerator supporting multiple codecs
• Rich peripheral set: USB 2.0, UART, SPI, I2C, MMC/SD, GPIO, etc.
• Low power consumption with multiple power management modes
• POP (Package-on-Package) support for memory stacking

Target Applications

• Portable navigation devices (e.g., Garmin nuvi series)
• Automotive infotainment systems (e.g., dashboard displays, rear-seat entertainment)
• Industrial control and automation (e.g., PLCs, HMI panels)
• Medical imaging equipment (e.g., portable ultrasound)
• 5G base station control boards (e.g., remote radio unit controllers)
• Smart home gateways and IoT hubs

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for OMAP3530ECBBA. Our core advantages include:

• 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
• In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
• HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
• Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
• BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

• 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
• RoHS Compliant: All electronic components comply with international environmental and safety standards.
• Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

OMAP3530ECBBA 是德州儀器 (TI) 推出的一款高性能、低功耗應用處理器，基於 OMAP™ 3 架構。它集成了 ARM Cortex-A8 核心和 TMS320C64x+ DSP，為多媒體和圖形密集型應用提供了強大的平台。該器件採用 515 球 POP-FCBGA 封裝（12x12 mm），專為需要高處理效率和豐富功能集成的嵌入式系統設計。

詳細技術參數

核心特性

• 雙核架構：ARM Cortex-A8 用於通用計算，C64x+ DSP 用於信號處理
• 集成 PowerVR SGX530 GPU，支持 2D/3D 圖形加速
• IVA 2.2 硬件視頻加速器，支持多種編解碼器
• 豐富的外設：USB 2.0、UART、SPI、I2C、MMC/SD、GPIO 等
• 低功耗設計，支持多種電源管理模式
• 支持 POP（封裝疊層）以堆疊記憶體

典型應用場景

• 便攜式導航設備（例如 Garmin nuvi 系列）
• 汽車信息娛樂系統（例如儀表板顯示、後座娛樂）
• 工業控制與自動化（例如 PLC、HMI 面板）
• 醫療影像設備（例如便攜式超聲）
• 5G 基站控制板（例如遠程射頻單元控制器）
• 智能家居網關和 IoT 集線器

環球供應鏈與批發合作夥伴方案

在 Jasin Chip，我們為 OMAP3530ECBBA 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括：

• 全天候環球客戶支援：專業團隊為您提供即時報價及技術支援，無需漫長等待。
• 現貨庫存，即日發貨：確保現貨充足。下午 4 點前確認訂單，即可安排當天寄出。
• 深港聯動，結算靈活：深圳直發全球，物流高效可靠；支援香港銀行戶口轉賬及多幣種結算。
• Escrow 擔保交易：支援 Escrow.com 平台交易，保障買賣雙方權益，小批量訂單亦可安心在線下單。
• BOM 配單與樣板服務：提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨，具備完善的品質保證及產品可追溯性。

• 100% 原廠正貨：承諾所有供應零件均為原裝現貨，品質嚴格把關，來源清晰可追溯。
• 符合 RoHS 認證：所有電子元器件均符合國際環保標準及相關安全認證。
• 原廠封裝保護：嚴格保留原廠原始包裝及封條，確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨，提供 BOM 配單及現貨庫存支援，歡迎查詢。

HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]