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OMAPL137DZKB3 TI DSP+ARM Processor | 256-BGA (17x17) | 300MHz C674x, 300MHz ARM9

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产品描述
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Product Overview

The OMAPL137DZKB3 is a highly integrated dual-core processor from Texas Instruments, combining a C674x floating-point DSP core and an ARM926EJ-S core in a single 256-ball BGA package (17x17 mm). This device is designed for applications requiring both high-performance digital signal processing and general-purpose processing capabilities. The DSP core operates at up to 300 MHz, delivering 2400 MIPS and 1800 MFLOPS, while the ARM9 core runs at up to 300 MHz, providing ample control and interface handling. The OMAPL137DZKB3 includes a rich set of peripherals such as USB 2.0, Ethernet MAC, LCD controller, and multiple serial interfaces, making it suitable for industrial, audio, and communication systems.

Detailed Technical Specifications

Parameter Value
Part Number OMAPL137DZKB3
Manufacturer Texas Instruments (TI)
Package 256-BGA (17x17 mm)
DSP Core C674x, up to 300 MHz
ARM Core ARM926EJ-S, up to 300 MHz
DSP MIPS 2400 MIPS
DSP MFLOPS 1800 MFLOPS
On-Chip Memory 256KB L2 RAM, 64KB L1 Program, 64KB L1 Data
External Memory Interface DDR2, mDDR, SDRAM, NAND Flash, NOR Flash
USB USB 2.0 OTG x1, USB 1.1 Host x1
Ethernet 10/100 Mbps Ethernet MAC (MII/RMII)
LCD Controller Up to 1024x768 resolution
Serial Interfaces 3x UART, 2x SPI, 2x I2C, 2x McASP, 1x McBSP
Timers 3x 64-bit General-Purpose Timers, 1x Watchdog Timer
Operating Temperature -40°C to +105°C
Supply Voltage Core: 1.2V, I/O: 1.8V/3.3V

Key Features

  • Dual-core architecture: C674x DSP + ARM926EJ-S
  • High-performance floating-point DSP for audio, industrial, and communication algorithms
  • Rich peripheral set including USB 2.0, Ethernet, LCD controller, and multiple serial interfaces
  • Low power consumption with multiple power-down modes
  • Integrated memory management unit (MMU) on ARM side
  • Support for multiple boot modes (NAND, NOR, SPI, UART)
  • Industrial temperature range (-40°C to +105°C)

Target Applications

  • Industrial automation: Programmable logic controllers (PLCs), motor control drives
  • Audio processing: Professional audio mixers, effects processors, VoIP gateways
  • Communication: 5G small cell base stations, network routers, protocol converters
  • Medical devices: Patient monitoring systems, diagnostic imaging equipment
  • Automotive: Infotainment systems, dashboard controllers, telematics units
  • Consumer electronics: Smart home hubs, digital signage, point-of-sale terminals

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for OMAPL137DZKB3. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

OMAPL137DZKB3 是德州儀器(TI)推出的一款高度集成的雙核處理器,在單個 256 球 BGA 封裝(17x17 mm)中結合了 C674x 浮點 DSP 內核和 ARM926EJ-S 內核。該器件專為需要高性能數字信號處理和通用處理能力的應用而設計。DSP 內核最高運行在 300 MHz,提供 2400 MIPS 和 1800 MFLOPS,而 ARM9 內核最高運行在 300 MHz,提供充足的控制和接口處理能力。OMAPL137DZKB3 包含豐富的外設,如 USB 2.0、以太網 MAC、LCD 控制器和多個串行接口,適用於工業、音頻和通信系統。

詳細技術參數

參數 數值
型號 OMAPL137DZKB3
製造商 德州儀器 (TI)
封裝 256-BGA (17x17 mm)
DSP 內核 C674x,最高 300 MHz
ARM 內核 ARM926EJ-S,最高 300 MHz
DSP MIPS 2400 MIPS
DSP MFLOPS 1800 MFLOPS
片上存儲器 256KB L2 RAM,64KB L1 程序,64KB L1 數據
外部存儲器接口 DDR2、mDDR、SDRAM、NAND Flash、NOR Flash
USB USB 2.0 OTG x1,USB 1.1 Host x1
以太網 10/100 Mbps 以太網 MAC (MII/RMII)
LCD 控制器 最高 1024x768 分辨率
串行接口 3x UART、2x SPI、2x I2C、2x McASP、1x McBSP
定時器 3x 64 位通用定時器、1x 看門狗定時器
工作溫度 -40°C 至 +105°C
供電電壓 內核:1.2V,I/O:1.8V/3.3V

核心特性

  • 雙核架構:C674x DSP + ARM926EJ-S
  • 高性能浮點 DSP,適用於音頻、工業和通信算法
  • 豐富的外設集,包括 USB 2.0、以太網、LCD 控制器和多個串行接口
  • 低功耗,支持多種省電模式
  • ARM 側集成內存管理單元 (MMU)
  • 支持多種啟動模式(NAND、NOR、SPI、UART)
  • 工業溫度範圍(-40°C 至 +105°C)

典型應用場景

  • 工業自動化:可編程邏輯控制器 (PLC)、電機控制驅動器
  • 音頻處理:專業音頻混音器、效果處理器、VoIP 網關
  • 通信:5G 小型基站、網絡路由器、協議轉換器
  • 醫療設備:病人監護系統、診斷成像設備
  • 汽車電子:信息娛樂系統、儀表板控制器、遠程信息處理單元
  • 消費電子:智能家居中樞、數字標牌、銷售點終端

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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