OMAPL137DZKBT3 TI DSP+ARM Processor | 256-BGA (17x17) | 300MHz C674x, 300MHz ARM9

Product Overview

The OMAPL137DZKBT3 is a dual-core system-on-chip (SoC) from Texas Instruments, combining a C674x floating-point DSP core and an ARM926EJ-S microprocessor core. It is designed for applications requiring high performance and low power consumption. The device operates at up to 300 MHz for both cores and is housed in a 256-ball BGA package with a 17x17 mm footprint.

Detailed Technical Specifications

Key Features

• Dual-core architecture for parallel processing
• Floating-point DSP for high-precision computation
• Low power consumption with multiple power-saving modes
• Rich set of peripherals for connectivity and control
• Industrial temperature range

Target Applications

• Industrial automation controllers (e.g., PLCs)
• Audio processing equipment (e.g., digital mixers)
• Medical imaging devices (e.g., portable ultrasound)
• Communication infrastructure (e.g., 5G base station control)
• Automotive infotainment (e.g., dashboard displays)

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for OMAPL137DZKBT3. Our core advantages include:

• 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
• In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
• HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
• Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
• BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

• 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
• RoHS Compliant: All electronic components comply with international environmental and safety standards.
• Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

OMAPL137DZKBT3 是德州儀器推出的雙核心系統級晶片，結合了 C674x 浮點 DSP 核心和 ARM926EJ-S 微處理器核心。該器件專為需要高性能和低功耗的應用而設計，兩個核心均可運行在最高 300 MHz 的頻率下，並採用 256 球 BGA 封裝，尺寸為 17x17 mm。

詳細技術參數

核心特性

• 雙核心架構，支持並行處理
• 浮點 DSP，實現高精度計算
• 低功耗設計，多種省電模式
• 豐富的外設接口，便於連接和控制
• 工業級溫度範圍

典型應用場景

• 工業自動化控制器（如 PLC）
• 音頻處理設備（如數字調音台）
• 醫療成像設備（如便攜式超聲）
• 通信基礎設施（如 5G 基站控制）
• 汽車信息娛樂系統（如儀表盤顯示）

環球供應鏈與批發合作夥伴方案

在 Jasin Chip，我們為 OMAPL137DZKBT3 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括：

• 全天候環球客戶支援：專業團隊為您提供即時報價及技術支援，無需漫長等待。
• 現貨庫存，即日發貨：確保現貨充足。下午 4 點前確認訂單，即可安排當天寄出。
• 深港聯動，結算靈活：深圳直發全球，物流高效可靠；支援香港銀行戶口轉賬及多幣種結算。
• Escrow 擔保交易：支援 Escrow.com 平台交易，保障買賣雙方權益，小批量訂單亦可安心在線下單。
• BOM 配單與樣板服務：提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨，具備完善的品質保證及產品可追溯性。

• 100% 原廠正貨：承諾所有供應零件均為原裝現貨，品質嚴格把關，來源清晰可追溯。
• 符合 RoHS 認證：所有電子元器件均符合國際環保標準及相關安全認證。
• 原廠封裝保護：嚴格保留原廠原始包裝及封條，確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨，提供 BOM 配單及現貨庫存支援，歡迎查詢。

HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]