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TPS68401C4YFFR TI PMIC | 20-DSBGA | 4 Buck Converters, 3 LDOs

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产品描述
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Product Overview

The TPS68401C4YFFR from Texas Instruments is a highly integrated power management IC (PMIC) designed for space-constrained applications. Housed in a compact 20-pin DSBGA package (0.4mm pitch), it provides four step-down DC/DC converters and three low-dropout regulators (LDOs), delivering efficient power management for multi-rail systems. With input voltage range from 2.5V to 5.5V, it supports battery-powered and USB-powered devices. The device features I2C interface for dynamic voltage scaling and power sequencing, making it ideal for processors, FPGAs, and SoCs.

Detailed Technical Specifications

Parameter Value
Input Voltage Range 2.5V to 5.5V
Number of Buck Converters 4
Buck Output Voltage Range 0.6V to 3.3V
Buck Output Current per Channel Up to 1.5A
Number of LDOs 3
LDO Output Voltage Range 0.8V to 3.3V
LDO Output Current per Channel Up to 300mA
Switching Frequency 2.25MHz (typical)
I2C Interface Up to 3.4MHz (HS mode)
Operating Temperature Range -40°C to +85°C
Package 20-DSBGA (2.0mm x 1.5mm)

Key Features

  • Four high-efficiency step-down converters with integrated FETs
  • Three low-noise LDOs for analog and digital loads
  • I2C-controlled dynamic voltage scaling (DVS) and power sequencing
  • Power-good outputs and over-current/thermal protection
  • Small footprint: 20-ball DSBGA package (0.4mm pitch)
  • Low quiescent current for battery-powered applications

Target Applications

  • 5G base stations: Powering FPGA cores and I/O banks (e.g., Xilinx Zynq UltraScale+)
  • Automotive dashboards: Powering infotainment processors (e.g., Qualcomm Snapdragon SA8155)
  • Industrial cameras: Powering image sensors and ISP (e.g., Sony IMX series)
  • Portable medical devices: Powering ARM Cortex-based MCUs (e.g., STM32MP1)
  • IoT gateways: Powering Wi-Fi/Bluetooth SoCs (e.g., ESP32-S3)

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for TPS68401C4YFFR. Our core advantages include:

  • 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
  • In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
  • HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
  • Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
  • BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

  • 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
  • RoHS Compliant: All electronic components comply with international environmental and safety standards.
  • Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

TPS68401C4YFFR 是德州儀器(TI)推出的一款高度集成的電源管理 IC(PMIC),專為空間受限的應用設計。採用緊湊的 20 引腳 DSBGA 封裝(0.4mm 間距),提供四個降壓 DC/DC 轉換器和三個低壓差穩壓器(LDO),為多電壓軌系統提供高效電源管理。輸入電壓範圍為 2.5V 至 5.5V,支援電池供電和 USB 供電設備。該器件具有 I2C 接口,可實現動態電壓調節和上電時序控制,非常適合處理器、FPGA 和 SoC。

詳細技術參數

參數 數值
輸入電壓範圍 2.5V 至 5.5V
降壓轉換器數量 4
降壓輸出電壓範圍 0.6V 至 3.3V
降壓每通道輸出電流 最高 1.5A
LDO 數量 3
LDO 輸出電壓範圍 0.8V 至 3.3V
LDO 每通道輸出電流 最高 300mA
開關頻率 2.25MHz(典型值)
I2C 接口 最高 3.4MHz(高速模式)
工作溫度範圍 -40°C 至 +85°C
封裝 20-DSBGA(2.0mm x 1.5mm)

核心特性

  • 四個高效降壓轉換器,集成 FET
  • 三個低噪聲 LDO,適用於模擬和數字負載
  • I2C 控制的動態電壓調節(DVS)和上電時序
  • 電源正常輸出和過流/過熱保護
  • 小尺寸:20 球 DSBGA 封裝(0.4mm 間距)
  • 低靜態電流,適合電池供電應用

典型應用場景

  • 5G 基站:為 FPGA 內核和 I/O 供電(例如 Xilinx Zynq UltraScale+)
  • 汽車儀表板:為信息娛樂處理器供電(例如 Qualcomm Snapdragon SA8155)
  • 工業相機:為圖像傳感器和 ISP 供電(例如 Sony IMX 系列)
  • 便攜醫療設備:為 ARM Cortex 微控制器供電(例如 STM32MP1)
  • 物聯網網關:為 Wi-Fi/藍牙 SoC 供電(例如 ESP32-S3)

環球供應鏈與批發合作夥伴方案

在 Jasin Chip,我們為 TPS68401C4YFFR 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括:

  • 全天候環球客戶支援:專業團隊為您提供即時報價及技術支援,無需漫長等待。
  • 現貨庫存,即日發貨:確保現貨充足。下午 4 點前確認訂單,即可安排當天寄出。
  • 深港聯動,結算靈活:深圳直發全球,物流高效可靠;支援香港銀行戶口轉賬及多幣種結算。
  • Escrow 擔保交易:支援 Escrow.com 平台交易,保障買賣雙方權益,小批量訂單亦可安心在線下單。
  • BOM 配單與樣板服務:提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

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Jasin Chip 承諾所有出貨產品均為原廠正貨,具備完善的品質保證及產品可追溯性。

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HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]

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