TLE94613ESV33XUMA1 Infineon System Basis Chip | PG-TSDSO-24-1 | 3.3V, CAN FD, LIN

Product Overview

The TLE94613ESV33XUMA1 is a highly integrated System Basis Chip (SBC) from Infineon, designed for automotive and industrial applications. It combines a 3.3V low-dropout voltage regulator (LDO), a CAN FD transceiver, a LIN transceiver, and advanced fail-safe features in a compact PG-TSDSO-24-1 package. This device simplifies system design by reducing external components and enhancing reliability.

Detailed Technical Specifications

Key Features

• Integrated 3.3V LDO with high accuracy and low dropout
• CAN FD transceiver with high-speed data rates up to 5 Mbps
• LIN transceiver supporting LIN 2.2 and SAE J2602
• Advanced fail-safe functions including window watchdog and limp-home mode
• Very low quiescent current for battery-powered applications
• Enhanced ESD and EMI performance
• Small footprint PG-TSDSO-24-1 package

Target Applications

• Automotive body control modules (e.g., door modules, seat control)
• 5G base station power management units
• Industrial sensor interfaces (e.g., pressure sensors, temperature sensors)
• Dashboard and infotainment systems
• Battery management systems (BMS) for electric vehicles

Global Supply Chain & Wholesale Solutions

At Jasin Chip, we provide professional supply chain and wholesale solutions for TLE94613ESV33XUMA1. Our core advantages include:

• 24/7 Global Customer Support: Professional team providing instant quotes and technical support worldwide.
• In-stock Inventory, Same-day Shipping: We maintain localized stock; orders confirmed before 4 PM are shipped the same day.
• HK-SZ Synergy, Flexible Settlement: Direct global shipping from Shenzhen with support for HK bank transfers and multi-currency.
• Escrow Secured Transactions: We support Escrow.com for secure transactions, ensuring peace of mind for batch orders.
• BOM Kitting & Sampling Services: Specialized sourcing for testing samples and urgent shortage components.

Quality Assurance & Compliance

Jasin Chip guarantees that all delivered products are 100% original factory stock with full quality assurance and traceability.

• 100% Original & Authentic: All components are guaranteed to be authentic with strict quality control.
• RoHS Compliant: All electronic components comply with international environmental and safety standards.
• Original Factory Packaging: We maintain original factory packaging and seals to ensure ESD protection and physical integrity.

產品概述

TLE94613ESV33XUMA1 是英飛凌高度集成的系統基礎晶片 (SBC)，專為汽車和工業應用設計。它結合了 3.3V 低壓差穩壓器 (LDO)、CAN FD 收發器、LIN 收發器以及先進的故障安全功能，採用緊湊的 PG-TSDSO-24-1 封裝。該器件通過減少外部元件和增強可靠性簡化了系統設計。

詳細技術參數

核心特性

• 集成 3.3V LDO，高精度、低壓差
• CAN FD 收發器，高速數據速率高達 5 Mbps
• LIN 收發器，支持 LIN 2.2 和 SAE J2602
• 先進的故障安全功能，包括窗口看門狗和跛行模式
• 極低的靜態電流，適合電池供電應用
• 增強的 ESD 和 EMI 性能
• 小型 PG-TSDSO-24-1 封裝

典型應用場景

• 汽車車身控制模塊（例如車門模塊、座椅控制）
• 5G 基站電源管理單元
• 工業傳感器接口（例如壓力傳感器、溫度傳感器）
• 儀表板和信息娛樂系統
• 電動汽車電池管理系統 (BMS)

環球供應鏈與批發合作夥伴方案

在 Jasin Chip，我們為 TLE94613ESV33XUMA1 提供全面的供應鏈與批發解決方案。 我們的核心優勢包括：

• 全天候環球客戶支援：專業團隊為您提供即時報價及技術支援，無需漫長等待。
• 現貨庫存，即日發貨：確保現貨充足。下午 4 點前確認訂單，即可安排當天寄出。
• 深港聯動，結算靈活：深圳直發全球，物流高效可靠；支援香港銀行戶口轉賬及多幣種結算。
• Escrow 擔保交易：支援 Escrow.com 平台交易，保障買賣雙方權益，小批量訂單亦可安心在線下單。
• BOM 配單與樣板服務：提供樣板測試及認證支援。專注一站式 BOM 配套及緊急缺料採購服務。

品質保證與合規

Jasin Chip 承諾所有出貨產品均為原廠正貨，具備完善的品質保證及產品可追溯性。

• 100% 原廠正貨：承諾所有供應零件均為原裝現貨，品質嚴格把關，來源清晰可追溯。
• 符合 RoHS 認證：所有電子元器件均符合國際環保標準及相關安全認證。
• 原廠封裝保護：嚴格保留原廠原始包裝及封條，確保物流過程中的靜電防護 (ESD) 與物理安全。

以上產品均為原廠正貨，提供 BOM 配單及現貨庫存支援，歡迎查詢。

HONG KONG JASIN SEMICONDUCTOR TECHNOLOGY COMPANY LIMITED
Trusted Partner for Automotive, Industrial, and Hard-to-find Components.
WhatsApp: +852 5209 9691 | Email: [email protected]